Process visual library
Semiconductor Manufacturing
josh@semivisual.com
< select a visualisation >
FEOL
01
GAA Transistor (FEOL)
02
ALD
03
SADP (ALD)
MOL / BEOL
04
MEOL Contacts
05
BEOL Metallisation (M0–M2)
06
Dual Damascene
Bonding
07
Wire Bonding
08
Flip Chip (C4 / BGA)
09
Flux TCB
10
Fluxless TCB
11
Hybrid Bonding (D2W)
Substrate and PCB
12
ABF Substrate (FC-BGA)
13
Multilayer PCB
Components
14
MLCC
15
Memory Buffers (RCD/DB)
Optics
16
Photonic IC
17
Optical Transceiver
18
Traditional Transceiver
19
LPO
20
NPO
21
CPO
Process
Fork
42
Forksheet FET
HKMG
38
STI & HKMG Gate
Wafer
39
Wafer Manufacturing
SAQP
40
SAQP Patterning
CFET
41
CFET (Complementary FET)
BSPDN
34
Backside Power (BSPDN)
ALE
35
Atomic Layer Etch
Epi
36
Selective Epitaxy
Implant
37
Ion Implantation
EUV
26
EUV Lithography
CMP
22
CMP
Adv. Packaging
Assy
43
Underfill · Mould · Dice
FOWLP
30
Fan-Out WLP / InFO
EMIB
31
EMIB Bridge
TSV
23
Through-Si Via (TSV)
CoWoS
24
CoWoS · 2.5D Interposer
Memory & Devices
3D NAND
32
3D NAND Flash
CIS
33
CMOS Image Sensor
SiC
27
SiC Power MOSFET
GaN
28
GaN HEMT
DRAM
29
DRAM Cell (1T1C)
HBM
25
HBM Stack
Components & RF
R · L
46
Resistors & Inductors
Ta Cap
47
Tantalum / Electrolytic Cap
XTAL
48
Crystal / MEMS Resonator
Power
49
Power Packaging
MEMS
50
MEMS Sensor
RF FEM
51
RF Front-End Module
BAW
44
BAW / SAW Filter
Laser
45
VCSEL · DFB · PD
AI Accelerators
Hopper
52
NVIDIA Hopper H100
Blackwell
53
NVIDIA Blackwell B200
Rubin
54
NVIDIA Rubin R200
TPU v7
55
Google TPU v7 Ironwood
TPU v8
56
Google TPU v8