Process visual library
Semiconductor Manufacturing
josh@semivisual.com
< select a visualisation >
Browse
close ×
FEOL
01
GAA Transistor (FEOL)
147
FinFET Transistor
02
ALD
03
SADP (ALD)
42
Forksheet FET
38
STI & HKMG Gate
39
Wafer Manufacturing
40
SAQP Patterning
41
CFET (Complementary FET)
34
Backside Power (BSPDN)
35
Atomic Layer Etch
36
Selective Epitaxy
37
Ion Implantation
26
EUV Lithography
116
High-NA EUV
117
EUV Photomask
118
EUV Photoresist
119
Process Control · Metrology
22
CMP
168
Wet Cleaning
169
Dry Strip & Ash
170
Wafer Bevel & Edge
MOL / BEOL
04
MEOL Contacts
05
BEOL Metallisation (M0–M2)
06
Dual Damascene
72
Self-Aligned Contacts · COAG
73
Wrap-Around Contact
74
Co / Ru Local Interconnect
75
Subtractive Ru (Semi-Damascene)
76
Self-Aligned Vias (ASD)
77
Air-Gap Interconnects
78
Low-κ / ULK Dielectrics
79
Via Prefill (Hybrid Metal)
80
BEOL MIM Capacitor
81
Passivation · Pad · RDL
Bonding
07
Wire Bonding
08
Flip Chip (C4 / BGA)
09
Flux TCB
10
Fluxless TCB
11
Hybrid Bonding (D2W)
106
Hybrid Bonding (W2W)
177
Cu Pillar & Microbump
178
Laser-Assisted Bonding
Substrate and PCB
12
ABF Substrate (FC-BGA)
13
Multilayer PCB
107
Glass-Core Substrate
158
E-Glass Yarn & Cloth
159
T-Glass (Low-CTE) Yarn
Optics
16
Photonic IC
17
Optical Transceiver
18
Traditional Transceiver
19
LPO
20
NPO
21
CPO
113
LRO · Linear Receive
114
XPO · eXtra-dense Pluggable
115
MPO-16 Connector
137
Optical Circuit Switch
138
Hollow-Core · Multi-Core Fibre
45
VCSEL · DFB · PD
57
EML (EA-Modulated Laser)
58
Tunable Laser (ITLA)
59
III-V-on-Si Laser
139
InP Laser Fab
60
TFLN Modulator
61
Comb Laser Source
62
VCSEL Array (LiDAR)
63
EDFA / SOA Amplifiers
182
SiPh Modulators · MRM vs MZM
Adv. Packaging
43
Underfill · Mould · Dice
30
Fan-Out WLP / InFO
31
EMIB Bridge
23
Through-Si Via (TSV)
24
CoWoS · 2.5D Interposer
98
TSMC SoIC · 3D
131
SoIC-X · Memory on Logic
99
CoWoS-L · LSI + RDL
109
CoWoS-S · Si Interposer
110
CoWoS-R · RDL Interposer
111
EMIB-T · TSV Bridge
112
CoPoS · Chip-on-Panel
132
Direct-to-Chip Liquid Cooling
133
DAF · TIM · Thermal Stack
100
Intel Foveros
101
Fan-In WLCSP
102
Panel-Level (FOPLP)
103
System-on-Wafer
104
Leadframe (SOIC·QFN)
105
Antenna-in-Package
134
Wafer Probe
135
Final Test · SLT · Burn-In
136
Known-Good-Die Flow
179
UCIe · Die-to-Die
180
Vertical Power Delivery
Memory
32
3D NAND Flash
127
3D NAND · Channel Hole
29
DRAM Cell (1T1C)
124
DRAM Capacitor · HAR + ALD
108
SRAM (6T Cell)
25
HBM Stack
123
HBM4 · 16-Hi Stack
130
CXL Memory Expander
126
3D DRAM (VS-DRAM)
129
NAND Package · SSD
171
4F² DRAM (VCT)
172
Mo Word Lines
173
GDDR7
174
LPDDR5X & SOCAMM
175
HBM4 Base Die
176
HBM Stacking · TCB→Hybrid
Components
14
MLCC
15
Memory Buffers (RCD/DB)
33
CMOS Image Sensor
46
Resistors & Inductors
47
Tantalum / Electrolytic Cap
48
Crystal / MEMS Resonator
50
MEMS Sensor
51
RF Front-End Module
44
BAW / SAW Filter
181
Silicon Capacitors
Power
27
SiC Power MOSFET
28
GaN HEMT
49
Power Packaging
88
Si Trench MOSFET
89
Superjunction MOSFET
90
IGBT (Field-Stop)
91
SiC Trench MOSFET
92
SiC Schottky Diode
93
Vertical GaN FET
94
BCD Process (PMIC)
95
DrMOS · Power Stage
96
Isolated Gate Driver
97
Ga₂O₃ Devices
AI Accelerators
52
NVIDIA Hopper H100
53
NVIDIA Blackwell B200
54
NVIDIA Rubin R200
55
Google TPU v7 Ironwood
56
Google TPU v8
64
Google TPU 8i Zebrafish
65
AWS Trainium3
66
Meta MTIA
67
AMD Instinct MI355X
68
Microsoft Azure Maia
69
Intel Gaudi 3
70
Cerebras WSE-3
71
Groq LPU
199
Custom AI ASIC Value Chain
200
NVIDIA Rubin CPX
201
Huawei Ascend 910C / 950
202
OpenAI × Broadcom XPU
CPUs
82
NVIDIA Vera
83
AMD EPYC Venice
84
Intel Clearwater Forest
85
AWS Graviton4
86
Google Axion
87
Arm AGI CPU
Data Centre
Racks & pods
140
NVL72 Rack Build
205
NVIDIA Kyber · Rubin Ultra
204
AMD Helios Rack
203
Google TPU Pod · ICI + OCS
143
Rack Power Generations
Power & cooling
148
Power Journey: Grid to Core
152
Site Power
149
Solid-State Transformer
141
Rack Power Chain
142
800V Sidecar Rack
150
Rack PSU: PFC + LLC
151
Protection + Backup
154
Tray Power: Rails + Passives
153
Cooling Power
208
Immersion & Microfluidic Cooling
Networking
155
Scale-Up Networking
156
Scale-Out Networking
157
Scale-Across Networking
206
Switch Silicon · Tomahawk 6
144
DPU / SmartNIC
207
224G PAM4 SerDes Lane
Laser content
209
Laser Census · GPU → Rack → Hall
210
Lasers in Scale-Up
211
Lasers in Scale-Out
212
Lasers in Scale-Across
213
Lasers in CPO and NPO
Display
145
MicroLED
146
LTPO OLED Backplane
Overviews
160
The AI Chip Journey
161
AI Rack Bill of Materials
162
Die Yield · Reticle · Chiplets
163
The Memory Wall · Roofline
164
Logic Roadmap · FinFET→GAA→CFET
165
Advanced Packaging Roadmap
166
HBM Roadmap · HBM2E→HBM5
167
2.5D Platforms · CoWoS/EMIB-T/CoPoS
Equipment
183
Inside an EUV Scanner
184
Inside an Etch Chamber
185
Inside an ALD Reactor
186
Inside an ECD Plating Tool
187
Inside an Ion Implanter
188
Inside a TC Bonder
189
Inside a Hybrid Bonder
190
Wafer Test · Probe Card & ATE
Materials & Fab
191
ALD / CVD Precursors
192
Specialty & Bulk Gases
193
Photoresist Supply Chain
194
CMP Consumables
195
PVD Sputter Targets
196
Chamber Consumables & Parts
197
Filtration & Purification
198
Sub-Fab & Facilities
☰
Browse
▾
select a visualisation
‹
›